The result of these failures was a class action lawsuit and subsequent settlement to address problems with Dell, HP and Apple computers. This eventually leads to a catastrophic failure, although the way the chip fails is quite random. On the affected chips, the working temperature of the underfill material was too low for the task and allowed the chip to move slightly if temperature was raised above a certain level, weakening the solder joints by which the die is attached. Underfill materials are a type of glue that keeps the silicon die firmly attached to the packaging material, which is where the connection to the actual pins takes place. The reason for the high failure rate was because of improper selection of the underfill material for the chip. NVIDIA CEO Jen-Hsun Huang and CFO Marvin Burkett were involved in a lawsuit filed on 9 September 2008 alleging that their knowledge of the flaw, and their intent to hide it, resulted in NVIDIA losing 31% on the stock markets. ![]() NVIDIA states this issue should not affect many chips, whereas others assert that all of the chips in these series are potentially affected. Some chips of the GeForce 8 series (concretely those from the G84 and G86 series) may suffer from an overheating problem.
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